During the grinding process of silicon carbide micropowder as an abrasive, its cutting ability will decrease. What is the reason? Let us take a look at it together: the main reason for the reduction of silicon carbide micropowder abrasive cutting ability: the fragmentation of abrasive particles
. The number of large abrasive grains that can produce cutting effect is reduced, and the broken small abrasive grains are easily blocked by chips, so that they cannot play the role of cutting. Before the abrasive grains are broken, their sharp corners are not significantly blunted, and the cutting ability is not good. Not completely lost, just slightly less granular. Of course, too large abrasive particles will also reduce the cutting ability, because the particle size is too large and easy to break.
It can be seen that there is an abrasive grain size with higher cutting power for each specific situation. The quality of the grinding effect mainly depends on the amount of abrasive grains that can guarantee a higher cutting ability during the grinding process and the length of time that the amount can be maintained. In order to avoid fragmentation of the abrasive grains, when selecting the abrasive grain size, the factors affecting the fragmentation of the abrasive grains, such as the grinding ability, the hardness of the grinding tool material, and the properties of the workpiece material, should be considered together, so that the fragmentation situation is greatly reduced. .